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GIGABYTE B760M DS3H AX Motherboard + Intel Core i7-14700F (14th GEN) Processor BUNDLE

GIGABYTE B760M DS3H AX Motherboard + Intel Core i7-14700F (14th GEN) Processor BUNDLE

Regular price $778.00 SGD
Regular price Sale price $778.00 SGD
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Gigabyte B760M DS3H AX (rev. 1.x)

Intel®B760 Chipset

  • Supports Intel® Core™ 14th/ 13th /12th processors
  • Unparalleled Performance: Hybrid 6+2+1 Phases Digital VRM Solution
  • Dual Channel DDR5: 4*DIMMs XMP Memory Module Support
  • Next Generation Storage: 2*PCIe 4.0 x4 M.2 Connectors
  • M.2 Thermal Guard: To Ensure M.2 SSD Performance
  • EZ-Latch: PCIe 4.0x16 Slot with Quick Release Design
  • Fast Networks: 2.5GbE LAN & Wi-Fi 6E 802.11ax
  • Extended Connectivity: Rear USB-C® 10Gb/s, DP, HDMI
  • Smart Fan 6: Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus: Update BIOS Without Installing the CPU, Memory and Graphics Card

Intel® Core™ i7-14700F
(33M Cache, up to 5.40 GHz)

CPU Specifications

  • Total Cores - 20
  • # of Performance-cores - 8
  • # of Efficient-cores - 12
  • Total Threads - 28
  • Max Turbo Frequency - 5.4 GHz
  • Intel® Turbo Boost Max Technology 3.0 Frequency ‡ - 5.4 GHz
  • Performance-core Max Turbo Frequency - 5.3 GHz
  • Efficient-core Max Turbo Frequency - 4.2 GHz
  • Performance-core Base Frequency - 2.1 GHz
  • Efficient-core Base Frequency - 1.5 GHz
  • Cache - 33 MB Intel® Smart Cache
  • Total L2 Cache - 28 MB
  • Processor Base Power - 65 W
  • Maximum Turbo Power - 219 W

Memory Specifications

  • Max Memory Size (dependent on memory type) - 192 GB
  • Memory Types - Up to DDR5 5600 MT/s, Up to DDR4 3200 MT/s
  • Max # of Memory Channels - 2
  • Max Memory Bandwidth - 89.6 GB/s

Expansion Options

  • Direct Media Interface (DMI) Revision - 4.0
  • Max # of DMI Lanes - 8
  • Scalability - 1S Only
  • PCI Express Revision - 5.0 and 4.0
  • PCI Express Configurations ‡ - Up to 1x16+4, 2x8+4
  • Max # of PCI Express Lanes - 20

Package Specifications

  • Sockets Supported - FCLGA1700
  • Max CPU Configuration- 1
  • Thermal Solution Specification - PCG 2020C
  • TJUNCTION - 100 °C
  • Package Size -45.0 mm x 37.5 mm
  • Max Operating Temperature - 100 °C

Advanced Technologies

  • Intel® Volume Management Device (VMD) - Yes
  • Intel® Gaussian & Neural Accelerator - 3.0
  • Intel® Thread Director - Yes
  • Intel® Deep Learning Boost (Intel® DL Boost) on CPU - Yes
  • Intel® Speed Shift Technology - Yes
  • Intel® Turbo Boost Max Technology 3.0 ‡ - Yes
  • Intel® Turbo Boost Technology ‡ - 2.0
  • Intel® Hyper-Threading Technology ‡ - Yes
  • Intel® 64 ‡ - Yes
  • Instruction Set - 64-bit
  • Instruction Set Extensions - Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
  • Idle States - Yes
  • Enhanced Intel SpeedStep® Technology - Yes
  • Thermal Monitoring Technologies - Yes

Security & Reliability

  • Intel® Standard Manageability (ISM) ‡ - Yes
  • Intel® Control-Flow Enforcement Technology - Yes
  • Intel® AES New Instructions - Yes
  • Secure Key - Yes
  • Intel® OS Guard - Yes
  • Execute Disable Bit ‡ - Yes
  • Intel® Boot Guard - Yes
  • Mode-based Execute Control (MBEC) - Yes
  • Intel® Virtualization Technology (VT-x) ‡ - Yes
  • Intel® Virtualization Technology for Directed I/O (VT-d) ‡ - Yes
  • Intel® VT-x with Extended Page Tables (EPT) ‡ - Yes
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